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Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint | ACS Applied Electronic Materials
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Microstructures of the pure copper. a As-received, b 450 °C annealing,... | Download Scientific Diagram
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Specimen- and grain-size dependence of compression deformation behavior in nanocrystalline copper - ScienceDirect
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Distribution of grain sizes in 90 pct drawn copper wire after annealing... | Download Scientific Diagram
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Effects of the grain size gradient on the microstructural evolution in gradient nano‐grained copper with initial central crack - Liu - 2020 - Material Design & Processing Communications - Wiley Online Library
Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint | ACS Applied Electronic Materials
![Materials | Free Full-Text | Size Effect on Mechanical Properties and Texture of Pure Copper Foil by Cold Rolling Materials | Free Full-Text | Size Effect on Mechanical Properties and Texture of Pure Copper Foil by Cold Rolling](https://www.mdpi.com/materials/materials-10-00538/article_deploy/html/images/materials-10-00538-g014.png)
Materials | Free Full-Text | Size Effect on Mechanical Properties and Texture of Pure Copper Foil by Cold Rolling
![Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint | ACS Applied Electronic Materials Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint | ACS Applied Electronic Materials](https://pubs.acs.org/cms/10.1021/acsaelm.9b00720/asset/images/medium/el9b00720_0003.gif)
Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint | ACS Applied Electronic Materials
![Table 3 from L © u-EFFECT OF GRAIN SIZE AND ANNEALING TREATMENT ON STEADY STATE CREEP OF COPPER BY | Semantic Scholar Table 3 from L © u-EFFECT OF GRAIN SIZE AND ANNEALING TREATMENT ON STEADY STATE CREEP OF COPPER BY | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/dba6ba08aca82ce5f9d312808a2302ab8be4fb8a/9-Table3-1.png)
Table 3 from L © u-EFFECT OF GRAIN SIZE AND ANNEALING TREATMENT ON STEADY STATE CREEP OF COPPER BY | Semantic Scholar
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Figure 5 from Improvement of substrate and package warpage by copper plating process optimization | Semantic Scholar
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